Source: Bosch announcement
STUTTGART and DRESDEN, Germany – From cars and e-bikes to household appliances and wearables – semiconductors are an integral part of all electronic systems. They are the motor that drives the modern world of technology. Bosch recognized their growing significance early on and has now announced investment of further billions of euros in order to strengthen its own semiconductor business.
By 2026, Bosch plans to invest another €3 billion in its semiconductor division as part of the IPCEI funding program on microelectronics and communications technology.
“Microelectronics is the future and is vital to the success of all areas of Bosch business. With it, we hold a master key to tomorrow’s mobility, the internet of things, and to what we at Bosch call technology that is ‘Invented for life’,” said Dr. Stefan Hartung, chairman of the Bosch board of management, at the Bosch Tech Day 2022 in Dresden.
Bosch to Expand Chip Production
One of the projects Bosch plans to fund with this investment is the construction of two new development centers – in Reutlingen and Dresden – at a combined cost of more than €170 million.
In addition, the company will spend €250 million during the coming year on the creation of an extra 3,000 square meters of clean-room space at its wafer fab in Dresden.
“We’re gearing up for continued growth in demand for semiconductors – also for the benefit of our customers,” Hartung said. “For us, these miniature components mean big business.”
Promoting microelectronics to increase Europe’s competitiveness
Within the framework of the European Chips Act, the European Union and German federal government are providing additional funding to develop a robust ecosystem for the European microelectronics industry.
The objective is to double Europe’s slice of global semiconductor production from 10 to 20 percent by the end of the decade. The newly launched IPCEI on Microelectronics and Communication Technology is intended primarily to promote research and innovation.
“Europe can and must capitalize on its own strengths in the semiconductor industry,” Hartung said. “More than ever, the goal must be to produce chips for the specific needs of European industry. And that means not only chips at the bottom end of the nanoscale.” Electronic components used in the electromobility industry, for example, require process sizes of between 40 and 200 nanometers. This is exactly what the Bosch wafer fabs are designed for.
To view the entire announcement, click HERE.