Source: 300 Below, Inc.
DECATUR, Ill. and CHICAGO — mHUB and MxD presented 300 Below, Inc. the award winner for Innovation of the Year in Midwest Manufacturing Technology at the third-annual Fourth Revolution Awards (4RevAwards).
The industry awards ceremony was held this week at Chicago’s Museum of Science & Industry, recognizing leadership, innovation, and achievements of the Midwest’s manufacturing ecosystem.
300 Below received the 4RevAward in Innovation from judges across the manufacturing technology ecosystem, recognizing 300 Below’s cryogenic treatment for advancing multiple manufacturing technologies and significantly improving the nation’s manufacturing ecosystem.
“300 Below is proud to be revolutionary, elevating innovation in the defense manufacturing industrial base,” said Prescott Paulin, President at 300 Below. “As America regrows manufacturing capabilities, our clients seek ways to avoid shrinking margins and overseas job exports. Our process transforms metal parts, extending a competitive advantage to manufacturers to make parts last longer and perform better than ever before. Benefits include lower operating costs, lower tooling expenses, plus reduced downtime on manufacturing lines. We treat tools used to make items as well as finished products before they ship.”
AFWERX, through the US Air Force Research Laboratory (AFRL), awarded ~$1,500,000 in small business innovation research (SBIR) funding to 300 Below to improve at-risk military metals. 300 Below triples the life of at-risk military metals for ~20 percent of an item’s cost, doubling barrel life and increasing accuracy for military firearms up to 50 percent, plus reducing downtime for vehicles and aircraft by tripling the life of brake parts, extending a competitive advantage to our military beyond any other nation in the world.
Prior 4RevAward recipients include General Electric, Microsoft, Marmon, Wiegel, and Light Guide. ArcelorMittal, Bank of America, CBRE, Comcast, Accenture, BCG, KPMG, and McKinsey are primary sponsors of the 4RevAwards.